Fundamentals (plasma/surface processes, simulation)
|
| J.P. Booth |
(Ecole Polytechnique, France) |
Ion, electron and radical dynamics in a dual-frequency dielectric etcher |
| M. Kushner |
(Iowa State Univ., USA) |
Advancing the Development of Plasma Sources and Processes by Simulation |
| E. Stamate |
(Nagoya Univ., Romania) |
Controlling the ion flux on substrates of different geometry by sheath-lens
focusing effect |
|
Diagnostics
|
| G. Cunge |
(CNRS, France) |
Plasma/reactor walls interactions in silicon and metal gate etching processes |
| L. J. Overzet and M. J. Goeckner |
(Univ. Texas at Dallas, USA) |
In-situ study of plasma-wall interactions in inductively coupled fluorocarbon plasma |
| R. McWilliams |
(Univ. California at Irvine, USA) |
LIF Ion Diagnostics in Light of Plasma Processing |
|
Plasma Damage
|
| P. Aum |
(Spiders, USA) |
Plasma Damage in 65 nm and Smaller Devices |
|
Process technologies (plasma etching, CVD)
|
| U-In. Chung |
(Samsung, Korea) |
Current and Future Memory Technology |
| S-K. Lee |
(Hynix, Korea) |
Contact etch challenges for nana-scaled semiconductor device |
| S. Sinnott |
(Univ. of Florida, USA) |
Dependence of plasma-induced modification of surfaces on polyatomic ion
chemistry |
|
Low-k, high-k
|
| K. Komura |
(MIRAI, Japan) |
A Novel Organosiloxane Vapor Annealing Process for Improving Properties of Porous Low-k Films |
| H. Hayashi |
(Toshiba Corp., Japan) |
Highly selective SiOC/Si3N4 and Si3N4/SiOC etching by preciseion energy control for dual damascene formation |
| K. Yonekura |
(Renesas, Japan) |
High-precision dual-damascene patterning for sub-65-nm node Cu/Low-k interconnects
|
| K-K. Choi |
(Magnachip Com., Korea) |
Characterization and Integration of Low-k Dielectrics for 65nm Technology
and Below |
| W. J. Yoo |
(National Univ. of Singapore, Singapore) |
Dry Etching Process of High-k / Metal Gate Stacks for CMOS Application |
|
FPD processes
|
| J. Jang |
(Kyunhee Univ., Korea) |
High-performance organic thin film transistor for display application |
| H. Kobayashi |
(ALTEDEC, Japan) |
Low-temperature processes for advanced FPDs |
| A. A. Howling, L. Sansonnens, Ch. Hollenstein, and J. P. M. Schmitt* |
(Ecole Polytechnique, Switzerland and *Unaxis Displays, France) |
Electromagnetic sources of nonuniformity in large area capacitive plasma
reactors |
| S.K. Hong |
(LG Electronics, Korea) |
Maskless Laser Imaging Technology for FPD Patterning |
| MunPyo Hong |
(Samsung Electronics, Korea) |
Flexible display technology (tentative) |
|
Nanotechnology
|
| J.-M. Ting |
(National Cheng Kung Univ., Korea) |
Growth and characterizations of one-dimensional materials |
| Y. Baba |
(Nagoya Univ., Japan) |
Nanobiodevice: from Genomics/Proteomics to Medical Applicatio |
|
New dry process concept (micro plasmas, atmospheric plasmas, etc.)
|
|
A. Schwabedissen and J. Engemann |
(JE Plasma Consult GmbH and University of Wuppertal, Germany) |
Design and diagnostics of atmospheric pressure plasma jets
|
|