Reviews1 のバックアップの現在との差分(No.1)


#author("2020-11-20T22:19:19+09:00","default:ishikawa","ishikawa")
#author("2024-03-13T18:17:25+09:00","default:ishikawa","ishikawa")
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This is a list of review articles
This is a list of review articles about nanoprocess, nanofabrication, and nanotechnology, including plasma etching and plasma-enhanced film deposition

[2020]
[2023]

-[209] Electron spin resonance as a tool to monitor the influence of novel processing technologies on food properties
--Trends in Food Science and Technology 100, pp. 77-87 (April 17, 2020) [[DOI:https://doi.org/10.1016/j.tifs.2020.03.032]]
---Francisco J. Barba, Shahin Roohinejad, ''Kenji Ishikawa'', Sze Ying Leong, Alaa El-Din A Bekhit, Jorge A. Saraiva, and Nikolai Lebovka
-[267] &color(white,red){OPEN};    ''Science-based, data-driven developments in plasma processing for material synthesis and device-integration technologies''
--Japanese Journal of Applied Physics 62 (SA), SA0803 pp. 1-37 (February 2023). [[(DOI):https://doi.org/10.35848/1347-4065/ac9189]]
---Makoto Kambara, ... and ''Kenji Ishikawa''

An understanding of the multiscale hierarchies of complex behaviors of plasma-related phenomena, including plasma generation in physics and chemistry, transport of energy and mass through the sheath region, and morphology- and geometry-dependent surface reactions is presently required to control systems with the state-of-the-art deep learning, machine learning, and artificial intelligence. Prediction of plasma parameters and discovery of processing recipes are asserted by outlining the emerging science-based, data-driven approaches.

----
[2019]

-[202] Review of methods for the mitigation of plasma-induced damage to low-dielectric-constant interlayer dielectrics used for semiconductor logic device interconnects
--Plasma Processes and Polymers 16 (9), 1900039 (pp. 1-20) (September 5, 2019). [[DOI:https://doi.org/10.1002/ppap.201900039]]
-[202] ''Review of methods for the mitigation of plasma-induced damage to low-dielectric-constant interlayer dielectrics used for semiconductor logic device interconnects''
--Plasma Processes and Polymers 16 (9), 1900039 pp. 1-20 (September, 2019). [[(DOI):https://doi.org/10.1002/ppap.201900039]], [[(Repository):https://www.researchgate.net/publication/334053718_Review_of_methods_for_the_mitigation_of_plasma-induced_damage_to_low-dielectric-constant_interlayer_dielectrics_used_for_semiconductor_logic_device_interconnects]]
---Hideshi Miyajima, ''Kenji Ishikawa'', Makoto Sekine, and Masaru Hori

-[195] &color(white,red){Free}; Progress and perspectives in dry processes for leading-edge manufacturing of devices: Toward intelligent processes and virtual product development
--Japanese Journal of Applied Physics 58 (SE), SE0804 (pp. 1-21) (May 30, 2019) [[DOI:https://doi.org/10.7567/1347-4065/ab163b]]
//---Taku Iwase, Yoshito Kamaji, Song Yun Kang, Kazunori Koga, Nobuyuki Kuboi, Moritaka Nakamura, Nobuyuki Negishi, Tomohiro Nozaki, Shota Nunomura, Daisuke Ogawa, Mitsuhiro Omura, Tetsuji Shimizu, Kazunori Shinoda, Yasushi Sonoda, Haruka Suzuki, Kazuo Takahashi, Takayoshi Tsutsumi, Kenichi Yoshikawa, Tatsuo Ishijima, and ''Kenji Ishikawa''
The developments in advanced interconnect technology for semiconductor logic devices for the mitigation of plasma-induced damage to low-dielectric-constant (low-k) materials, including fluorosilicate glass and carbon-doped silicon oxide is reviewed. 
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-[194] &color(white,red){Free}; Progress and perspectives in dry processes for emerging multidisciplinary applications: How can we improve our use of dry processes?
--Japanese Journal of Applied Physics 58 (SE), SE0803 (pp. 1-17) (May 30, 2019) [[DOI:https://doi.org/10.7567/1347-4065/ab163a]]
-[195] &color(white,red){Free}; ''Progress and perspectives in dry processes for leading-edge manufacturing of devices: Toward intelligent processes and virtual product development''
--Japanese Journal of Applied Physics 58 (SE), SE0804 pp. 1-21 (May, 2019) [[(DOI):https://doi.org/10.7567/1347-4065/ab163b]]
//---Taku Iwase, Yoshito Kamaji, Song Yun Kang, Kazunori Koga, Nobuyuki Kuboi, Moritaka Nakamura, Nobuyuki Negishi, Tomohiro Nozaki, Shota Nunomura, Daisuke Ogawa, Mitsuhiro Omura, Tetsuji Shimizu, Kazunori Shinoda, Yasushi Sonoda, Haruka Suzuki, Kazuo Takahashi, Takayoshi Tsutsumi, Kenichi Yoshikawa, Tatsuo Ishijima, and ''Kenji Ishikawa''

-[193] &color(white,red){Free}; Progress and perspectives in dry processes for nanoscale feature fabrication: Fine pattern transfer and high-aspect-ratio feature formation
--Japanese Journal of Applied Physics 58 (SE), SE0802 (pp. 1-24) (May 30, 2019) [[DOI:https://doi.org/10.7567/1347-4065/ab1638]]
The methods for process monitoring, equipment control, modeling and simulation, and controlling plasma-induced damage, are required to control advanced plasma processes in high-volume manufacturing of semiconductor device production. The authors address the challenges of implementing "virtual product development" utilizing information technology.
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-[194] &color(white,red){Free}; ''Progress and perspectives in dry processes for emerging multidisciplinary applications: How can we improve our use of dry processes?''
--Japanese Journal of Applied Physics 58 (SE), SE0803 pp. 1-17 (May, 2019) [[(DOI):https://doi.org/10.7567/1347-4065/ab163a]]
//---Taku Iwase, Yoshito Kamaji, Song Yun Kang, Kazunori Koga, Nobuyuki Kuboi, Moritaka Nakamura, Nobuyuki Negishi, Tomohiro Nozaki, Shota Nunomura, Daisuke Ogawa, Mitsuhiro Omura, Tetsuji Shimizu, Kazunori Shinoda, Yasushi Sonoda, Haruka Suzuki, Kazuo Takahashi, Takayoshi Tsutsumi, Kenichi Yoshikawa, Tatsuo Ishijima, and ''Kenji Ishikawa''

-[192] &color(white,red){Free}; Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: A physics and chemistry perspective
--Japanese Journal of Applied Physics 58 (SE), SE0801 (pp. 1-14) (May 30, 2019) [[DOI:https://doi.org/10.7567/1347-4065/ab163e]]
//---''Kenji Ishikawa'', Tatsuo Ishijima, Tatsuru Shirafuji, Silvia Armini, Emilie Despiau-Pujo, Richard A. Gottscho, Keren J. Kanarik, Gert J. Leusink, Nathan Marchack, Takahide Murayama, Yasuhiro Morikawa, Gottlieb S. Oehrlein, Sangwuk Park, Hisataka Hayashi, and Keizo Kinoshita
Plasma medicine and plasma agriculture are currently topical applications that make use of atmospheric pressure plasmas. 
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[2018]
-[193] &color(white,red){Free}; ''Progress and perspectives in dry processes for nanoscale feature fabrication: Fine pattern transfer and high-aspect-ratio feature formation''
--Japanese Journal of Applied Physics 58 (SE), SE0802 pp. 1-24 (May, 2019) [[(DOI):https://doi.org/10.7567/1347-4065/ab1638]]
//---Taku Iwase, Yoshito Kamaji, Song Yun Kang, Kazunori Koga, Nobuyuki Kuboi, Moritaka Nakamura, Nobuyuki Negishi, Tomohiro Nozaki, Shota Nunomura, Daisuke Ogawa, Mitsuhiro Omura, Tetsuji Shimizu, Kazunori Shinoda, Yasushi Sonoda, Haruka Suzuki, Kazuo Takahashi, Takayoshi Tsutsumi, Kenichi Yoshikawa, Tatsuo Ishijima, and ''Kenji Ishikawa''

-[161] &color(white,red){Free}; &color(white,blue){Etch}; Progress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?
--Japanese Journal of Applied Physics 57 (6S2), 06JA01(May 25, 2018). [[DOI:https://doi.org/10.7567/JJAP.57.06JA01]]
---''Kenji Ishikawa'', Kazuhiro Karahashi, Tatsuo Ishijima, Sung Il Cho, Simon Elliott, Dennis Hausmann, Dan Mocuta, Aaron Wilson, and Keizo Kinoshita
The isotropic and anisotropic nature of both film deposition and etching is versatile for nanoscale fabrication of three-dimensional features, such as high-aspect-ratio (HAR) features. 
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[2017]
-[192] &color(white,red){Free}; ''Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: A physics and chemistry perspective''
--Japanese Journal of Applied Physics 58 (SE), SE0801 pp. 1-14 (May, 2019) [[(DOI):https://doi.org/10.7567/1347-4065/ab163e]]
//---''Kenji Ishikawa'', Tatsuo Ishijima, Tatsuru Shirafuji, Silvia Armini, Emilie Despiau-Pujo, Richard A. Gottscho, Keren J. Kanarik, Gert J. Leusink, Nathan Marchack, Takahide Murayama, Yasuhiro Morikawa, Gottlieb S. Oehrlein, Sangwuk Park, Hisataka Hayashi, and Keizo Kinoshita

-[J5] &color(white,red){Free}; 最先端プラズマバイオ技術
--Japanese Society of Radiation Chemistry 104, 3-14 (October 31, 2017) 放射線化学 (in Japanese) [[web:http://www.radiation-chemistry.org/kaishi.html]]
---Masaru Hori, ''Kenji Ishikawa'', Takashi Kondo, Hiromasa Tanaka, and Hiroshi Hashizume
The focus of this review is advances in atomic layer etching and area-selective deposition with activation or deactivation, especially in terms of materials scaling and variety. Control of high-aspect-ratio feature fabrication in semiconductor manufacturing and etched shapes of interior features at the nanoscale are needed. Issues related to profile distortion have received much attention. State-of-the-art techniques used in semiconductor manufacturing are reviewed and future challenges are outlined.
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-[133] &color(white,brown){PM}; State of the art in medical applications using non-thermal atmospheric pressure plasma
--Reviews on Modern Plasma Physics 1, 3 (July 3, 2017). [[DOI:https://doi.org/10.1007/s41614-017-0004-3]]
---Hiromasa Tanaka, ''Kenji Ishikawa'', Masaaki Mizuno, Shinya Toyokuni, Hiroaki Kajiyama, Fumitaka Kikkawa, Hans-Robert Metelmann, and Masaru Hori
[2018]

-[J4] &color(white,red){Free}; &color(white,red){ESR}; &color(white,brown){PM}; 電子スピン共鳴法を活用したプラズマバイオ反応プロセスの診断
--プラズマ核融合学会誌 2017年5月号 小特集「気相-液相反応プロセスにおける診断技術の進展」 [[PDF:https://www.jspf.or.jp/Journal/PDF_JSPF/jspf2017_05/jspf2017_05-246.pdf]]
---''石川健治'',近藤隆,竹田圭吾,呉準席,橋爪博司,田中宏昌,近藤博基,太田貴之,伊藤昌文,関根誠,堀勝
//&color(white,blue){Etch}; 
-[161] &color(white,red){Free->OPEN}; ''Progress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?''
--Japanese Journal of Applied Physics 57 (6S2), 06JA01 pp. 1-18 (May, 2018). [[(DOI):https://doi.org/10.7567/JJAP.57.06JA01]] Total citations: 62 (Mar. 2024)
---''Kenji Ishikawa'', et al.
//Kazuhiro Karahashi, Tatsuo Ishijima, Sung Il Cho, Simon Elliott, Dennis Hausmann, Dan Mocuta, Aaron Wilson, and Keizo Kinoshita

-[130] &color(white,blue){Etch}; Progress and prospects in nanoscale dry processes - How can we control atomic layer reactions?
--Japanese Journal of Applied Physics 56 (6S2), 06HA02  (June 1, 2017). Progress Review of DPS special issue. [[DOI:https://doi.org/10.7567/JJAP.56.06HA02]] 
---''Kenji Ishikawa'', Kazuhiro Karahashi, Takanori Ichiki, Jane P. Chang, Steven M. George, W. M. M. Kessels, Hae June Lee, Stefen Tinck, Jung Hwan Um, and Keizo Kinoshita
The focus of this review is placed on advances in fabrication technology that control surface reactions on three-dimensional features, as well as state-of-the-art techniques used in semiconductor manufacturing with a brief summary of future challenges.
----

[2014]
[2017]
//&color(white,blue){Etch}; 
-[130] ''Progress and prospects in nanoscale dry processes - How can we control atomic layer reactions?''
--Japanese Journal of Applied Physics 56 (6S2), 06HA02 pp. 1-13 (June, 2017). [[(DOI):https://doi.org/10.7567/JJAP.56.06HA02]], [[(Repository):https://www.researchgate.net/publication/317287557_Progress_and_prospects_in_nanoscale_dry_processes_How_can_we_control_atomic_layer_reactions]] Total citations: 43 (Mar. 2024)
---''Kenji Ishikawa'', et al.
//Kazuhiro Karahashi, Takanori Ichiki, Jane P. Chang, Steven M. George, W. M. M. Kessels, Hae June Lee, Stefen Tinck, Jung Hwan Um, and Keizo Kinoshita

-[P11] &color(white,red){ESR}; &color(white,brown){PA}; Diagnostics of plasma-biological surface interactions in low pressure and atmospheric pressure plasmas
--International Journal of Modern Physics: Conference Series 32, 1460318 (August 15, 2014).  [[DOI:https://doi.org/10.1142/S2010194514603184]], [[link to World Scientific Publishing Co.:http://www.worldscientific.com/doi/abs/10.1142/S2010194514603184]]
---''Kenji Ishikawa'', and Masaru Hori
The authors address the increasingly challenging demands in achieving atomic-level control of material selectivity and physicochemical reactions involving ion bombardment. The focus of this review is placed on advances in the development of fabrication technologies for state-of-the-art techniques used in nanoscale and atomic scale semiconductor manufacturing with a brief summary of future challenges.

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