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Proceedings of international conferences
*2023
*15th International Symposium on Advanced Plasma Science and Its Applications for Nitrides and Nanomaterials / 15th International Conference on Plasma-Nano Technology & Science （ISPlasma2023/IC-PLANTS2023） March 7-10, 2023
-(Keynote)
* 25th International Symposium on Plasma Chemistry (ISPC25) Kyoto, Japan May 21-26, 2023
* International Workshop on Plasma Agriculture (IWOPA) Korea June 18-22, 2023
-(Invited)
-(Invited) Plasma treatments in rice paddy fields: Impacts on yield and quality
--June 19, 10:50-11:20
---Kenji Ishikawa
* 35th International Conference on Phenomena in Ionized Gases (ICPIG),
* 35th International Conference on Phenomena in Ionized Gases (ICPIG), the Neitherland
-(Invited) Frontiers of Plasma Etching Technology for Advanced Semiconductor Devices
--July 11, 2023
---Kenji Ishikawa
* 40th Biotechnology
-[Invited] Plasma treatments in rice paddy fields: Impacts on yield and quality
* SSDM 2023, Nagoya
-Arun Kumar
* IAEA Technical Meeting on Emerging Applications of Plasma Science and Technology Sep 19 – 22, 2023 at IAEA Headquarters, Vienna
-Low temperature plasma life innovations: Functional reaction networks of radical chemistry
--Kenji Ishikawa
* 66th Radiation Chemistry
-[Invited] 低温プラズマのバイオ応用〜プラズマ照射効果〜
--S-1 9月28日 14：45～15：15
---Kenji Ishikawa
* 76th Annual Gaseous Electronics Conference (GEC) October 9–13, 2023; Michigan League, Ann Arbor, Michigan
-[Invited] GT1.00005 : Biomedical applications of plasma-activated solutions
--9:00 AM–9:30 AM Tuesday, October 10, 2023
---Hiromasa Tanaka, Masaaki Mizuno, ''Kenji Ishikawa'', Camelia Miron, Yasumasa Okazaki, Shinya Toyokuni, Kae Nakamura, Hiroaki Kajiyama, Masaru Hori
-GW1.00002 : Plasma-based pseudo-wet mechanism for cryogenic SiO2 etching using hydrogen-contained fluorocarbon gases with an in-situ surface analysis
--8:00 AM–9:30 AM, Wednesday, October 11, 2023
---Shih-Nan Hsiao, Makoto Sekine, Takayoshi Tsutsumi, ''Kenji Ishikawa'', Manabu Iwata, Maju Tomura, Yuki Iijima, Taku Gohira, Keiichi Matsushima, Yoshinobu Ohya, and Masaru Hori
* ADMETA Plus 2023
-[Invited] Plasma etching technology: Next milestone of assurance energy and environment
--10:00-10:25 November 13, 2023
---Kenji Ishikawa
* 69th AVS 2023
-Etching Selectivities of SiO2 and SiN Against a-C Films Using CF4/H2 with a Pseudo-Wet Plasma Etching Mechanism
--PS+TF-MoM-6 10:00-10:20 Monday Morning, November 6, 2023
---Yusuke Imai, S. Hsiao, M. Sekine, T. Tsutsumi, ''K. Ishikawa'', M. Iwata, M. Tamura, Y. Iijima, T. Gohira, K. Matsushima, Y. Ohya, and M. Hori
-A Pseudo-Wet Plasma Etching Mechanism for SiO2 at Cryogenic Temperature Using Hydrogen Fluoride Gas within-Situ Surface Monitoring
--PS1-ThA-1 14:20-14:40 Thursday Afternoon, November 9, 2023
--Shih-Nan Hsiao, M. Sekine, Y. Iijima, R. Suda, Y. Ohya, Y. Kihara, T. Tsutsumi, ''K. Ishikawa'', and M. Hori
-Surface Reactions During Atomic Layer Etching of Platinum by High-Density Nitrogen-Oxygen Plasma and Organic Acid Vapor
--AP+PS-FrM-4 9:20-9:40 Friday Morning, November 10, 2023
--Thi-Thuy-Nga Nguyen, D. Akagi, T. Uno, T. Okato, ''K. Ishikawa'', and M. Hori
* AEPSE 2023
-Selective Cytotoxicity of Plasma-Treated L-Arginine Solution on Human Breast Cancer Cells
--[Tu1B-2] 11:15-11:30 November 7, 2023
---Liyin Du
-Mechanisms of Selective Killing of Cancer Cells Against Normal Cells by Plasma activated Ringer’s Lactate Solution
--[Tu1B-3] 11:30-11:45 November 7, 2023
---Hiromasa Tanaka
-Evaluation of Autophagy-Inducing Substances in PAL Components on Cancer Cells
--[Tu1B-4] 11:45-12:00 November 7, 2023
---Taishi Yamakawa
-Cellular Response to Electrical Stimulation on Carbon Nanowalls Coated with Silicon Carbide
--[Tu1B-5] 12:00-12:15 November 7, 2023
---Koki Ono
-Transient Behavior of Cycle Process in Ar Plasma with Alternately Injected C4F8 and SF6
--[We3A-1] 15:00-15:20 November 8, 2023
---Taito Yoshie
-Unravelling Dissociation of Hydrofluorocarbon Molecules through Photoelectron–Photoion Coincidence (PEPICO)
Studies
--[We3A-4] 16:00-16:20 November 8, 2023
---Trung Nguyen Tran
* AADPP
-Wet-like plasma for the next generation of atomic layer etching
-[Invited] Wet-like plasma for the next generation of atomic layer etching
--A-10-I4 20min A-10 Plasma material processing-1 [Chair: Rajdeep Singh Rawat] 16:30-18:35, Nov. 13 [Room6-2]
---Thi-Thuy-Nga Nguyen
others
-Booming Low-temperature Plasma Sciences for a Creation of New Value
-[Plenary] Booming Low-temperature Plasma Sciences for a Creation of New Value
--Plenary-4 Nov. 15 8:30-10:30 [Main Hall] Chairs: M. Shiratani, xxx, xxx, H. Suk PL-14(30min)
---Masaru Hori
* MNC
others
-A mechanism for cryogenic etching of SiO2 using CF4/H2 and HF plasmas based on in-situ monitoring techniques
--16C-2-4 12:20- Wednesday, November 16, 2023 [Room C]
---Shih-Nan Hsiao, Yusuke Imai, Makoto Sekine, Nikolay Britun, Michael K. T. Mo, Yuki Iijima, Ryutaro Suda, Yoshinobu Ohya, Yoshihide Kihara, and Masaru Hori
* MRS-J
-プラズマ照射が引き起こすゼブラフィッシュの生残率と含有成分に対する影響
-The Impact of Plasma Irradiation on the Survival Rate and Composition of Zebrafish
--I-O15-007 16:50-17:10
---紅林 佑弥
---YUYA KUREBAYASHI
-プラズマ活性乳酸リンゲル液によるマクロファージのM1極性誘導
-Induction of macrophages to M1 polarity by plasma-activated Ringer's lactate solution-
--I-O15-009 17:30-17:50
---出野 雄大
---Yudai IDENO
* DPS 2023 November 21-22, 2023 at Nagoya
-Control of etching profile by bias supply timing in cyclic process using C4F8/SF6 gas modulated plasma
--A-4
---Taito Yoshie
-Electron-Beam-Assisted Self-limiting fluorination of GaN surface using XeF2 for Atomic Layer Etching
--D-2
---Yusuke Izumi
-A pseudo-wet cryogenic plasma etching of SiO2 investigated with in-situ surface monitoring
--E-1
---Makoto Sekine
-Hydrofluorocarbon Molecule Dissociation through Photoelectron-Photoion Coincidence (PEPICO) Studies
--E-3
---Trung Nguyen Tran
-Etch selectivities of SiO2 and SiN against a-C films using CF4/H2 plasma at low temperature
--E-4
---Yusuke Imai
-An approach to reduce surface charging with cryogenic plasma etching using hydrogen-fluoride contained gases
--E-5
---Shih-Nan Hsiao
-Compositions of Ions Related with Electrode Materials in Pulsed Plasma for High-Aspect-Ratio Hole Etching
--G-3
---Kazuki Toji
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