Blog20210227
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開始行:
[[Blog202102]]
*Surface activated bonding
**Tadatomo Suga, U Tokyo
精密機械工学専攻・須賀唯知 教授、近藤龍一(太陽誘電)(20...
ランテクニカルサービス株式会社、ボンドテック株式会社、お...
明星大学に異動 [[link>https://www.iag.meisei-u.ac.jp/meuh...
2021 7th International Workshop on Low Temperature Bondin...
F. S. Ohuchi and T. Suga (1994)
Surface activated bonding of silicon wafers at room tempe...
**Suga ECS abstract [[web>https://iopscience.iop.org/arti...
Surface activated bonding (SAB) : bonding of metal to met...
Surface activation process : bombardment of the surfaces ...
Al-Al and Al-Si3N4, Cu-Cu, Si-Si
2012 Lantechnical Service Co., Ltd (President: Yoshiie Ma...
bonding of polymer film to polymer film and polymer film ...
polyethylene naphthalate (PEN), polyethylene terephthalat...
argon (Ar) ion beam bombardment in an ultrahigh vacuum at...
An intermediate 10nm-Si layer and an iron (Fe) nano-adhes...
**ボンドテック
**Aymi Industries
[[真空学会誌>https://www.jstage.jst.go.jp/article/jvsj/49...
**Mitsubishi Heavy Industries
Cu/SiO2 hybrid bonding obtained by surface-activated bond...
1 keV Ar ion beam
*Plasma bonding
Biomedical micro fluid chip : PDMS and glass (plasma tre...
[[Wikipedia>https://en.wikipedia.org/wiki/Plasma-activate...
Grenoble
Fraunhofer M. Wiemer 3D packaging
D. Wünsch and M. Wiemer and M. Gabriel and T. Gessner (20...
R. E. Belford & S. Sood Surface activation using remote p...
6 Plasma activated bonding, In Handbook of Wafer Bonding ...
There are many companies of instrumentation
**Plasmatreat
**EVG
終了行:
[[Blog202102]]
*Surface activated bonding
**Tadatomo Suga, U Tokyo
精密機械工学専攻・須賀唯知 教授、近藤龍一(太陽誘電)(20...
ランテクニカルサービス株式会社、ボンドテック株式会社、お...
明星大学に異動 [[link>https://www.iag.meisei-u.ac.jp/meuh...
2021 7th International Workshop on Low Temperature Bondin...
F. S. Ohuchi and T. Suga (1994)
Surface activated bonding of silicon wafers at room tempe...
**Suga ECS abstract [[web>https://iopscience.iop.org/arti...
Surface activated bonding (SAB) : bonding of metal to met...
Surface activation process : bombardment of the surfaces ...
Al-Al and Al-Si3N4, Cu-Cu, Si-Si
2012 Lantechnical Service Co., Ltd (President: Yoshiie Ma...
bonding of polymer film to polymer film and polymer film ...
polyethylene naphthalate (PEN), polyethylene terephthalat...
argon (Ar) ion beam bombardment in an ultrahigh vacuum at...
An intermediate 10nm-Si layer and an iron (Fe) nano-adhes...
**ボンドテック
**Aymi Industries
[[真空学会誌>https://www.jstage.jst.go.jp/article/jvsj/49...
**Mitsubishi Heavy Industries
Cu/SiO2 hybrid bonding obtained by surface-activated bond...
1 keV Ar ion beam
*Plasma bonding
Biomedical micro fluid chip : PDMS and glass (plasma tre...
[[Wikipedia>https://en.wikipedia.org/wiki/Plasma-activate...
Grenoble
Fraunhofer M. Wiemer 3D packaging
D. Wünsch and M. Wiemer and M. Gabriel and T. Gessner (20...
R. E. Belford & S. Sood Surface activation using remote p...
6 Plasma activated bonding, In Handbook of Wafer Bonding ...
There are many companies of instrumentation
**Plasmatreat
**EVG
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