使っている装置:water vapor plasma (Aqua Plasma Cleaner AQ-500, Samco Inc.) under the following conditions: 50 W of plasma power, 12 sccm (standard cubic centimeters per minute) of gas flow, 40 s of plasma treatment time, and 10 Pa of pressure. ↑水蒸気
OH終端化,表面平坦性の維持,低汚染
硫酸・過酸化水素,アンモニア・過酸化水素水で大気圧低温接合
Surface activated bonding (須賀) Arビーム照射後,常温で荷重