Reviews1 のバックアップ(No.5)


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This is a list of review articles about nanoprocess, nanofabrication, and nanotechnology, including plasma etching and plasma-enhanced film deposition

[2023]

An understanding of the multiscale hierarchies of complex behaviors of plasma-related phenomena, including plasma generation in physics and chemistry, transport of energy and mass through the sheath region, and morphology- and geometry-dependent surface reactions is presently required to control systems with the state-of-the-art deep learning, machine learning, and artificial intelligence. Prediction of plasma parameters and discovery of processing recipes are asserted by outlining the emerging science-based, data-driven approaches.


[2019]

The developments in advanced interconnect technology for semiconductor logic devices for the mitigation of plasma-induced damage to low-dielectric-constant (low-k) materials, including fluorosilicate glass and carbon-doped silicon oxide is reviewed.


The methods for process monitoring, equipment control, modeling and simulation, and controlling plasma-induced damage, are required to control advanced plasma processes in high-volume manufacturing of semiconductor device production. The authors address the challenges of implementing "virtual product development" utilizing information technology.


Plasma medicine and plasma agriculture are currently topical applications that make use of atmospheric pressure plasmas.


The isotropic and anisotropic nature of both film deposition and etching is versatile for nanoscale fabrication of three-dimensional features, such as high-aspect-ratio (HAR) features.


The focus of this review is advances in atomic layer etching and area-selective deposition with activation or deactivation, especially in terms of materials scaling and variety. Control of high-aspect-ratio feature fabrication in semiconductor manufacturing and etched shapes of interior features at the nanoscale are needed. Issues related to profile distortion have received much attention. State-of-the-art techniques used in semiconductor manufacturing are reviewed and future challenges are outlined.


[2018]

The focus of this review is placed on advances in fabrication technology that control surface reactions on three-dimensional features, as well as state-of-the-art techniques used in semiconductor manufacturing with a brief summary of future challenges.


[2017]

The authors address the increasingly challenging demands in achieving atomic-level control of material selectivity and physicochemical reactions involving ion bombardment. The focus of this review is placed on advances in the development of fabrication technologies for state-of-the-art techniques used in nanoscale and atomic scale semiconductor manufacturing with a brief summary of future challenges.


Copyright Kenji Ishikawa (c) 2009-2023 Center for Low-temperature plasma sciences, Nagoya University.