Reviews1

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This is a list of review articles about nanoprocess, nanofabrication, and nanotechnology, including plasma etching and plasma-enhanced film deposition

[2023]

• [267] OPEN Science-based, data-driven developments in plasma processing for material synthesis and device-integration technologies
  • Japanese Journal of Applied Physics 62 (SA), SA0803 pp. 1-37 (February 2023). (DOI)
    • Makoto Kambara, ... and Kenji Ishikawa

An understanding of the multiscale hierarchies of complex behaviors of plasma-related phenomena, including plasma generation in physics and chemistry, transport of energy and mass through the sheath region, and morphology- and geometry-dependent surface reactions is presently required to control systems with the state-of-the-art deep learning, machine learning, and artificial intelligence. Prediction of plasma parameters and discovery of processing recipes are asserted by outlining the emerging science-based, data-driven approaches.

[2019]

• [202] Review of methods for the mitigation of plasma-induced damage to low-dielectric-constant interlayer dielectrics used for semiconductor logic device interconnects
  • Plasma Processes and Polymers 16 (9), 1900039 pp. 1-20 (September, 2019). (DOI), (Repository)
    • Hideshi Miyajima, Kenji Ishikawa, Makoto Sekine, and Masaru Hori

The developments in advanced interconnect technology for semiconductor logic devices for the mitigation of plasma-induced damage to low-dielectric-constant (low-k) materials, including fluorosilicate glass and carbon-doped silicon oxide is reviewed.

• [195] Free Progress and perspectives in dry processes for leading-edge manufacturing of devices: Toward intelligent processes and virtual product development
  • Japanese Journal of Applied Physics 58 (SE), SE0804 pp. 1-21 (May, 2019) (DOI)

The methods for process monitoring, equipment control, modeling and simulation, and controlling plasma-induced damage, are required to control advanced plasma processes in high-volume manufacturing of semiconductor device production. The authors address the challenges of implementing "virtual product development" utilizing information technology.

• [194] Free Progress and perspectives in dry processes for emerging multidisciplinary applications: How can we improve our use of dry processes?
  • Japanese Journal of Applied Physics 58 (SE), SE0803 pp. 1-17 (May, 2019) (DOI)

Plasma medicine and plasma agriculture are currently topical applications that make use of atmospheric pressure plasmas.

• [193] Free Progress and perspectives in dry processes for nanoscale feature fabrication: Fine pattern transfer and high-aspect-ratio feature formation
  • Japanese Journal of Applied Physics 58 (SE), SE0802 pp. 1-24 (May, 2019) (DOI)

The isotropic and anisotropic nature of both film deposition and etching is versatile for nanoscale fabrication of three-dimensional features, such as high-aspect-ratio (HAR) features.

• [192] Free Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: A physics and chemistry perspective
  • Japanese Journal of Applied Physics 58 (SE), SE0801 pp. 1-14 (May, 2019) (DOI)
    • Kenji Ishikawa, et al.

The focus of this review is advances in atomic layer etching and area-selective deposition with activation or deactivation, especially in terms of materials scaling and variety. Control of high-aspect-ratio feature fabrication in semiconductor manufacturing and etched shapes of interior features at the nanoscale are needed. Issues related to profile distortion have received much attention. State-of-the-art techniques used in semiconductor manufacturing are reviewed and future challenges are outlined.

[2018]

• [161] OPEN Progress in nanoscale dry processes for fabrication of high-aspect-ratio features: How can we control critical dimension uniformity at the bottom?
  • Japanese Journal of Applied Physics 57 (6S2), 06JA01 pp. 1-18 (May, 2018). (DOI) Total citations: 66 (Aug. 2024)
    • Kenji Ishikawa, et al.

The focus of this review is placed on advances in fabrication technology that control surface reactions on three-dimensional features, as well as state-of-the-art techniques used in semiconductor manufacturing with a brief summary of future challenges.

[2017]

• [130] Progress and prospects in nanoscale dry processes - How can we control atomic layer reactions?
  • Japanese Journal of Applied Physics 56 (6S2), 06HA02 pp. 1-13 (June, 2017). (DOI), (Repository) Total citations: 43 (Mar. 2024)
    • Kenji Ishikawa, et al.

The authors address the increasingly challenging demands in achieving atomic-level control of material selectivity and physicochemical reactions involving ion bombardment. The focus of this review is placed on advances in the development of fabrication technologies for state-of-the-art techniques used in nanoscale and atomic scale semiconductor manufacturing with a brief summary of future challenges.