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Surface activated bonding
Tadatomo Suga, U Tokyo
精密機械工学専攻・須賀唯知 教授、近藤龍一（太陽誘電）(2011) link
ランテクニカルサービス株式会社、ボンドテック株式会社、および産学連携コンソーシアムである電子実装工学研究所 web 2019年退職 link
明星大学に異動 link
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021) link
F. S. Ohuchi and T. Suga (1994)
Surface activated bonding of silicon wafers at room temperature Appl. Phys. Lett. 68, 2222 (1996); DOI
Suga ECS abstract web
Surface activated bonding (SAB) : bonding of metal to metal and to ceramics at room temperature.
Surface activation process : bombardment of the surfaces by Ar ions or neutral atoms in ultra-high vacuum.
Al-Al and Al-Si3N4, Cu-Cu, Si-Si
2012 Lantechnical Service Co., Ltd (President: Yoshiie Matsumoto)
bonding of polymer film to polymer film and polymer film to glass without the use of adhesives.
polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and Kapton (polyimide)
argon (Ar) ion beam bombardment in an ultrahigh vacuum at room temperature.
An intermediate 10nm-Si layer and an iron (Fe) nano-adhesion layer of less than 1nm thickness were deposited prior to the bonding
ボンドテック
Aymi Industries
Mitsubishi Heavy Industries
Cu/SiO2 hybrid bonding obtained by surface-activated bonding method at room temperature using Si ultra-thin films web
1 keV Ar ion beam
Plasma bonding
Biomedical micro fluid chip : PDMS and glass (plasma treatment)
Grenoble
Fraunhofer M. Wiemer 3D packaging
D. Wünsch and M. Wiemer and M. Gabriel and T. Gessner (2010). "Low temperature wafer bonding for microsystems using dielectric barrier discharge". MST News. 1/10. pp. 24–25.
R. E. Belford & S. Sood Surface activation using remote plasma for silicon to quartz wafer bonding. Microsystem Technologies volume 15, pages 407–412 (2009) link
6 Plasma activated bonding, In Handbook of Wafer Bonding edited by Peter Ramm, James Jian-Qiang Lu, (John Wiley & Sons, Feb 13, 2012)
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