Information | Committees

DPS2010 committee member list

International Organizing Committee

  Name Affiliation Country
Chair T. Ohiwa Toshiba Corp. Japan
Vice-chair M. Izawa Hitach High-Technologies Corp. Japan
Members T.-H. Ahn Samsung Electronics Co., Ltd. Korea
D. S. H. Chan National University of Singapore Singapore
H. Y. Chang Korea Advanced Institute of Science and Technology Korea
C. K. Choi Jeju National University Korea
V. Donnelly University of Houston USA
S. Fujimura Tokyo Institute of Technology Japan
N. Fujiwara Mitsubishi Electronic Corp. Japan
D. B. Graves University of California, Berkeley USA
J. G. Han Sungkyunkwan University Korea
M. Hori Nagoya University Japan
M. Horioka Applied Materials Inc. Japan
L. van den Hove Interuniversity Microelectronics Center (IMEC) Belgium
O. Joubert LTM/CNRS France
K. Kinoshita NEC Corp. Japan
M. J. Kushner University of Michigan USA
K. C. Leou National Tsing Hua University Taiwan
K. Nojiri Lam Research Corp. Japan
K. Ono Kyoto University Japan
L. Overzet University of Texas at Dallas USA
M. C. M. van de Sanden Eindhoven University of Technology (TU/e) the Netherlands
M. Shiratani Kyushu University Japan
S. Xu Nanyang Technological University Singapore
N. Yamamoto Tokyo Electron AT Ltd. Japan

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Executive Committee

  Name Affiliation Country
Chair S. Miyazaki Nagoya University Japan
Vice-chair K. Ono Kyoto University Japan
K. Kurihara Toshiba Corp. Japan
Members J. P. Chang University of California, Los Angeles USA
K. Eriguchi Kyoto University Japan
Y. S. Hwang Seoul National University Korea
T. Ishijima Nagoya University Japan
K. Ishikawa Nagoya University Japan
N. Itabashi Hitachi, Ltd. Japan
H. Kondo Nagoya University Japan
N. E. Lee Sungkyunkwan University Korea
Y. Morikawa ULVAC Inc. Japan
T. Nozaki Tokyo Institute of Technology Japan
M. Sekine Nagoya University Japan
E. Stamate Technical University of Denmark Denmark
K. Takeda Nagoya University Japan
T. Tatsumi Sony Corp. Japan
H. Toyoda Nagoya University Japan
R. Wise International Business Machines Corp. (IBM) USA

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Publication Committee

  Name Affiliation Country
Chair K. Eriguchi Kyoto University Japan
Vice-chair T. Nakano National Defense Academy of Japan Japan
K. Sasaki Hokkaido University Japan
Members T. Abe Niigata University Japan
P. Chabert École Polytechnique France
S. Hotta Kyoto Institute of Technology Japan
T. Ishijima Nagoya University Japan
N. Itabashi Hitachi, Ltd. Japan
K. Kinoshita NEC Corp Japan
L. Overzet University of Texas at Dallas USA
M. Shiratani Kyushu University Japan
E. Stamate Technical University of Denmark Denmark
T. Tatsumi Sony Corp. Japan
G. Y. Yeom Sungkyunkwan University Korea

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Program Committee

  Name Affiliation Country
Chair N. Itabashi Hitachi, Ltd. Japan
Vice-chair K. Kurihara Toshiba Corp. Japan
T. Tatsumi Sony Corp. Japan
Members K. Azuma Shimadzu Corp. Japan
J.-P. Booth CNRS/École Polytechnique France
J. P. Chang University of California, Los Angeles USA
K.-N. Chen National Chiao Tung University Taiwan
L. Chen TEL Technology Center, America USA
D. J. Economou University of Houston USA
M. Engelhardt Infineon Technologies Austria AG Germany
K. Eriguchi Kyoto University Japan
P. Favia University of Bari Italy
H. Hayashi Toshiba Corp. Japan
S. Higashi Hiroshima University Japan
M. Hiramatsu Meijo University Japan
T. Hirata Tokyo City University Japan
M. Honda Tokyo Electron AT Ltd. Japan
M. Horioka Applied Materials Inc. Japan
T. Ichiki The University of Tokyo Japan
K. Ishikawa Nagoya University Japan
C. J. Kang Samsung Electronics Co., Ltd. Korea
S. Y. Kang Tokyo Electron Ltd. Japan
K. Karahashi Osaka University Japan
K. Kawamoto Renesas Electronics Corp. Japan
W.M.M.Kessels Eindhoven University of Technology (TU/e) the Netherlands
H. Kobayashi Hitachi, Ltd. Japan
K. Koga Kyushu University Japan
H. Kokura FUJITSU Semiconductor Ltd. Japan
A. Kono Nagoya University Japan
A. Koshiishi Lam Research Corp. Japan
H. Kuwano Tohoku University Japan
S. K. Lee Hynix Semiconductor Inc. Korea
T. Maruyama Renesas Electronics Corp. Japan
Y. Morikawa ULVAC Inc. Japan
K. Nakamura Chubu University Japan
K. Nakamura Mitsubishi Electric Corp. Japan
M. Nakamura SEMATECH/ISMI Japan
N. Negishi Hitachi, Ltd. Japan
Y. Noda DENSO Corp. Japan
K. Nojiri Lam Research Corp. Japan
S. Nunomura Advanced Industrial Science and Technology (AIST) Japan
Y. Ohshita Toyota Technological Institute Japan
H. Ohtake Tohoku University Japan
T. Okumura Panasonic Corp. Japan
F. Roozeboom Eindhoven University of Technology (TU/e) the Netherlands
Y. Setsuhara Osaka University Japan
D. Shamiryan Interuniversity Microelectronics Center (IMEC) Belgium
Y. Shimogaki The University of Tokyo Japan
T. Shirafuji Osaka City University Japan
M. Tada NEC Corp. Japan
K. Takahashi Kyoto Institute of Technology Japan
K. Tamura Sharp Corp. Japan
S. Watanabe Hitachi High-Technologies Corp. Japan
T. Watanabe Waseda University Japan
T. Yagisawa Keio University Japan

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International Advisory Committee

  Name Affiliation Country
Chair J. Nishizawa Sophia University Japan
Members M. Esashi Tohoku University Japan
R. Gottscho Lam Research Corp. USA
Y. Horiike National Institute for Material Science (NIMS) Japan
T. Lill Applied Materials Inc. USA
H. Sugai Chubu University Japan
O. Takai Nagoya University Japan
S. Zaima Nagoya University Japan
K. Tachibana Ehime University Japan
T. Makabe Keio University Japan
M. Yoneda Renesas Electronics Corp. Japan
K. Tsujimoto Renesas Electronics Corp. Japan
S. Tachi Hitachi High-Technologies Corp. Japan

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